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Production Overview
Plastic dual in-line package (DIP)，plasticis Long Small Outline Package（LSOP） are principal packages using SMD technology. It is widely used in Signal isolation or photoelectric isolation，Control various loads.FSMC offers DIP4,DIP4M,DIP8A,LSOP4,SMD4,SMD8A series with lead counts 4，8leads.
Application
Dual in-line package，Long Small Outline Package are considered one of the most established industry standard packages. DIP,SMD,LSOP series is commonly used logic, memory, and micro-controllers. found in applications such as automotive consumer and communications products.
Features
* JEDEC standard compliant or reference
* Wide choice of pad sizes to meet die size per customer lead frame design capability
* Pb-free process ready and Green Molding Compound
Design Rule
| Wafer Thickness |
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80~280um |
Minimum Sawing
Street Width |
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≥60um |
| Minimum die Size |
|
0.20mm*0.20mm |
| Maximum wafer Size |
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D≤200mm |
Package Outline
| Optocoupler series (All units are in mm) |
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| Number |
PKG TYPE |
Lead count |
Lead Width |
Lead Thickness |
bond pad |
POD |
| 1 |
DIP-4 |
4 |
0.50 |
0.25 |
DOWN |
DOWN |
| 2 |
DIP-4M |
4 |
0.50 |
0.25 |
DOWN |
DOWN |
| 3 |
SMD-4 |
4 |
0.50 |
0.25 |
DOWN |
DOWN |
| 4 |
DIP-8A |
8 |
0.50 |
0.26 |
DOWN |
DOWN |
| 5 |
SMD-8A |
8 |
0.50 |
0.26 |
DOWN |
DOWN |
| 6 |
LSOP-4 |
4 |
0.40 |
0.25 |
DOWN |
DOWN |
Packing & Shipping
| Tube: |
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| Number |
PKG TYPE |
QTY/Tube |
Tube/Inner Box |
Total per inner box |
Boxe/case |
Total per case |
| 1 |
DIP-4 |
100 |
50 |
5000 |
10 |
50000 |
| 2 |
DIP-4M |
100 |
50 |
5000 |
10 |
50000 |
| 3 |
SMD-4 |
100 |
50 |
5000 |
10 |
50000 |
| 4 |
DIP-8A |
40 |
50 |
2000 |
10 |
20000 |
| 5 |
SMD-8A |
40 |
50 |
2000 |
10 |
20000 |
| 6 |
LSOP-4 |
100 |
100 |
10000 |
10 |
100000 |
| Carrier Tape: |
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| Number |
PKG TYPE |
QTY/Reel |
Reel/Inner Box |
Total per inner box |
Boxe/case |
Total per case |
| 1 |
SMD-4 |
1500 |
2 |
3000 |
5 |
15000 |
| 2 |
SMD-8A |
1000 |
2 |
2000 |
5 |
10000 |
| 3 |
LSOP-4 |
3000 |
2 |
6000 |
5 |
30000 |
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